HP-SBab(SST) Shrink Solder Seal Sleeve

Product Details

■ Application:
HP-SBag(SST) is Sealbag of HP-SST.It is customized minipacking, mainly for MRO (Mainterance Repairness Operation ) market. Transparent insulation sleeve provides encapsulation,inspect, strain relief, and insulation.Pre-fluxed solder provides controlled soldering process.One piece design, it consists of transparent heat shrinkable sleeve and fluxed solder. Provides insulation and lower the installed cost. Color hot-melt glue on two ends of heat shrinkable tube, connecting wires to component terminals, such as motor tabs, connector pins, and switch terminals,it is very convenience to use the exact wire dimension.
■ Characteristics:
●Shrinkage ratio 2:1
●Waterproof for wiring splices
●Transparent sleeve provides precise inspection
●Easy control soldering process
●Minimum Shrink Temp. 60℃
●Minimum Fully Recover Temp.110℃
●Fully melt temperature of solder: 138℃

■ Technical Data:

Operating temperature-55℃~125℃
voltage Resistant>600V
Protection typeIP67
Volume Resistivity (Ω cm):≥10 15
Dielectric Strength (KV/mm)≥25

■ Size:

No.Part No. 



Other sizes are available upon request.
●Item 1 : Heat shrinkable Sleeve , Transparent ,Radiation cross-linked modified polyolefin.
●Item 2: Solder Ring with flux
●Item 3: Glue rings
Standard color: White, Red, Blue,Yellow
Other colors are available upon request.

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